Invention Grant
US07902051B2 Method for fabrication of single crystal diodes for resistive memories 有权
用于制造用于电阻存储器的单晶二极管的方法

Method for fabrication of single crystal diodes for resistive memories
Abstract:
The present invention, in one embodiment, provides a method of producing a PN junction the method including providing a single crystal substrate; forming an insulating layer on the single crystal substrate; forming a via through the insulating layer to provide an exposed portion of the single crystal substrate; forming amorphous Si on at least the exposed portion of the single crystal substrate; converting at least a portion of the amorphous Si into single crystal Si; and forming dopant regions in the single crystal Si. In one embodiment the diode of the present invention is integrated with a memory device.
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