Electronic devices and methods for fabricating electronic devices are described. One method includes providing a first body with a plurality of composite bumps thereon, the composite bumps comprising a solder and magnetic particles. The method also includes applying a magnetic field to the magnetic particles to generate sufficient heat to melt the solder and form molten bump regions containing the magnetic particles therein. The method also includes coupling a second body to the first body through the molten bump regions, and cooling the molten bump regions to form solidified composite bumps coupling the second body to the first body. Other embodiments are described and claimed.