Invention Grant
US07902085B2 Droplet ejecting apparatus, method of forming a thin film, and substrate for a display device
有权
液滴喷射装置，薄膜形成方法以及显示装置用基板
- Patent Title: Droplet ejecting apparatus, method of forming a thin film, and substrate for a display device
- Patent Title (中): 液滴喷射装置，薄膜形成方法以及显示装置用基板
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Application No.: US11349406Application Date: 2006-02-07
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Publication No.: US07902085B2Publication Date: 2011-03-08
- Inventor: Jin-Koo Chung , Kyu-Ha Chung , Joon-Hoo Choi
- Applicant: Jin-Koo Chung , Kyu-Ha Chung , Joon-Hoo Choi
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2005-0011285 20050207
- Main IPC: H01L21/31
- IPC: H01L21/31 ; H01L21/469
Abstract:
A droplet ejecting apparatus, method of forming a thin film, and a substrate for a display device, wherein a droplet ejecting apparatus includes a first ejecting unit ejecting a first droplet on a substrate, a second ejecting unit ejecting a second droplet on the substrate along a path defined by a movement of the first ejecting unit, and a transporting unit connected with the first ejecting unit and the second ejecting unit to transport the first ejecting unit and the second ejecting unit.
Public/Granted literature
- US20060176335A1 Droplet ejecting apparatus, method of forming a thin film, and substrate for a display device Public/Granted day:2006-08-10
Information query
IPC分类:
