Invention Grant
- Patent Title: Heat sink arrangement for electrical apparatus
- Patent Title (中): 电器的散热器布置
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Application No.: US12475728Application Date: 2009-06-01
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Publication No.: US07902464B2Publication Date: 2011-03-08
- Inventor: Kenzo Danjo , Hideo Ishii , Masao Katooka , Shuji Yokoyama
- Applicant: Kenzo Danjo , Hideo Ishii , Masao Katooka , Shuji Yokoyama
- Applicant Address: JP Osaka-shi, Osaka-fu
- Assignee: Sansha Electric Manufacturing Company, Limited
- Current Assignee: Sansha Electric Manufacturing Company, Limited
- Current Assignee Address: JP Osaka-shi, Osaka-fu
- Agency: Duane Morris LLP
- Priority: JP2005-152393 20050525
- Main IPC: H05K1/16
- IPC: H05K1/16
Abstract:
A printed circuit board (120) includes an insulating substrate (120a) on which conductive films (120b) are formed. Semiconductor devices (8) disposed external to the printed circuit board (120) have their leads (24a, 24b, 24c) connected to the conductive films. A flexible portion (30) is formed in the insulating substrate (120a) at a location near the location where the leads (24a, 24b, 24c) are connected to the conductive films (120b).
Public/Granted literature
- US20090237898A1 HEAT SINK ARRANGEMENT FOR ELECTRICAL APPARATUS Public/Granted day:2009-09-24
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