Invention Grant
- Patent Title: Method of manufacturing sealed electronic component and sealed electronic component
- Patent Title (中): 密封电子元件和密封电子元件的制造方法
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Application No.: US11547323Application Date: 2005-03-30
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Publication No.: US07902481B2Publication Date: 2011-03-08
- Inventor: Keisuke Kigawa , Haruyuki Hiratsuka , Tomohisa Wada
- Applicant: Keisuke Kigawa , Haruyuki Hiratsuka , Tomohisa Wada
- Applicant Address: JP Tokyo JP Nagano
- Assignee: Citizen Holdings Co., Ltd,Citizen Finetech Miyota Co., Ltd
- Current Assignee: Citizen Holdings Co., Ltd,Citizen Finetech Miyota Co., Ltd
- Current Assignee Address: JP Tokyo JP Nagano
- Agency: Sughrue Mion, PLLC
- Priority: JP2004-102803 20040331; JP2004-282817 20040928
- International Application: PCT/JP2005/006193 WO 20050330
- International Announcement: WO2005/096373 WO 20051013
- Main IPC: H01L21/50
- IPC: H01L21/50 ; B23K26/20
Abstract:
A method of manufacturing a sealed electronic component, which can seal a housing in a high-vacuum state while preventing enclosure of a gas within the housing, as well as achieving the improvement in manufacturing efficiency. According to the method, after forming an unwelded section by a primary welding process step, including a first beam irradiation process step and a second beam irradiation process step, annealing treatment is performed in an annealing process step by irradiating an electron beam to a predetermined portion on a locus of the electron beam formed in the first beam irradiation process step. The locus may be on a housing or a lid.
Public/Granted literature
- US20070199925A1 Method Of Manufacturing Sealed Electronic Component And Sealed Electronic Component Public/Granted day:2007-08-30
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