Invention Grant
US07902563B2 Light emitting diode module with heat spreading plate between capping layer and phosphor layer
有权
发光二极管模块，在封盖层和磷光体层之间具有散热板
- Patent Title: Light emitting diode module with heat spreading plate between capping layer and phosphor layer
- Patent Title (中): 发光二极管模块，在封盖层和磷光体层之间具有散热板
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Application No.: US11515248Application Date: 2006-09-05
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Publication No.: US07902563B2Publication Date: 2011-03-08
- Inventor: Yu-sik Kim , Hyung-kun Kim
- Applicant: Yu-sik Kim , Hyung-kun Kim
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: KR10-2006-0037218 20060425
- Main IPC: H01L33/64
- IPC: H01L33/64
Abstract:
A long life light-emitting diode (LED) module is provided. The LED module includes: a light-emitting chip; a phosphor layer formed of phosphor materials that transform light emitted from the light-emitting chip into light having a longer wavelength than the light emitted from the light-emitting chip; a capping layer that is formed on the light-emitting chip and protects the light-emitting chip; and a heat spreading plate that is disposed between the capping layer and the phosphor layer that dissipates heat generated in the light-emitting chip and the phosphor layer.
Public/Granted literature
- US20070246712A1 Light emitting diode module Public/Granted day:2007-10-25
Information query
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