Invention Grant
- Patent Title: Capacitor pair structure for increasing the match thereof
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Application No.: US12219365Application Date: 2008-07-21
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Publication No.: US07902583B2Publication Date: 2011-03-08
- Inventor: Chih-Min Liu
- Applicant: Chih-Min Liu
- Applicant Address: TW Hsin-Tien, Taipei
- Assignee: Via Technologies, Inc.
- Current Assignee: Via Technologies, Inc.
- Current Assignee Address: TW Hsin-Tien, Taipei
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Priority: TW92137848A 20031231
- Main IPC: H01L27/13
- IPC: H01L27/13
Abstract:
A capacitor pair structure for increasing the match thereof has two finger electrode structures interlacing with each other in parallel and a common electrode being between the two finger electrode structures to form a capacitor pair structure with an appropriate ratio. Also, the capacitor pair structure could further increase its entire capacitance through vias connecting the same capacitor pair structures on different metal layers.
Public/Granted literature
- US20080315276A1 Capacitor pair structure for increasing the match thereof Public/Granted day:2008-12-25
Information query
IPC分类:
