Invention Grant
- Patent Title: Double gate depletion mode MOSFET
- Patent Title (中): 双栅耗尽型MOSFET
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Application No.: US11972811Application Date: 2008-01-11
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Publication No.: US07902606B2Publication Date: 2011-03-08
- Inventor: John B. Campi, Jr. , Richard A. Phelps , Robert M. Rassel , Michael J. Zierak
- Applicant: John B. Campi, Jr. , Richard A. Phelps , Robert M. Rassel , Michael J. Zierak
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Richard M. Kotulak, Esq.
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/336

Abstract:
A metal-oxide-semiconductor field effect transistor (MOSFET) has a body layer that follows the contour of exposed surfaces of a semiconductor substrate and contains a bottom surface of a shallow trench and adjoined sidewalls. A bottom electrode layer vertically abuts the body layer and provides an electrical bias to the body layer. A top electrode and source and drain regions are formed on the body layer. The thickness of the body layer is selected to allow full depletion of the body layer by the top electrode and a bottom electrode layer. The portion of the body layer underneath the shallow trench extends the length of a channel to enable a high voltage operation. Further, the MOSFET provides a double gate configuration and a tight control of the channel to enable a complete pinch-off of the channel and a low off-current in a compact volume.
Public/Granted literature
- US20090179272A1 DOUBLE GATE DEPLETION MODE MOSFET Public/Granted day:2009-07-16
Information query
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