Invention Grant
- Patent Title: Semiconductor module
- Patent Title (中): 半导体模块
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Application No.: US12149114Application Date: 2008-04-28
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Publication No.: US07902653B2Publication Date: 2011-03-08
- Inventor: Masafumi Horio , Tatsuo Nishizawa , Eiji Mochizuki , Rikihiro Maruyama
- Applicant: Masafumi Horio , Tatsuo Nishizawa , Eiji Mochizuki , Rikihiro Maruyama
- Applicant Address: JP Tokyo
- Assignee: Fuji Electric Systems Co., Ltd.
- Current Assignee: Fuji Electric Systems Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agent Manabu Kanesaka
- Priority: JP2007-132572 20070518
- Main IPC: H01L23/06
- IPC: H01L23/06
Abstract:
A semiconductor module includes a first metal foil; an insulating sheet mounted on a top surface of the first metal foil; at least one second metal foil mounted on a top surface of the insulating sheet; at least one semiconductor device mounted on the second metal foil; and a resin case for surrounding the first metal foil, insulating sheet, second metal foil, and semiconductor device. A bottom end of a peripheral wall of the resin case is located above a bottom surface of the first metal foil. A resin is provided inside the resin case to fill the inside of the resin case. The bottom surface of the first metal foil and the resin form a flat bottom surface so that the flat bottom surface contacts an external mounting member.
Public/Granted literature
- US20080284007A1 Semiconductor module and method for manufacturing semiconductor module Public/Granted day:2008-11-20
Information query
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