A semiconductor integrated circuit device described herein includes a semiconductor chip and a package on which the semiconductor chip is disposed. The semiconductor chip includes first electrode pads, and the package includes second electrode pads connected to the first electrode pads. The second electrode pads include signal pads and power supply pads, and are arranged in rows along the semiconductor chip. All the power supply pads of the second electrode pads are for supplying power to the semiconductor chip and are disposed in a row positioned farther from the semiconductor chip than another row. Each power supply line that leads out from a second power supply pad has a width not less than a width of the second power supply pad.