Invention Grant
- Patent Title: Power core devices and methods of making thereof
- Patent Title (中): 电力核心装置及其制造方法
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Application No.: US11732174Application Date: 2007-04-02
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Publication No.: US07902662B2Publication Date: 2011-03-08
- Inventor: Daniel I. Amey , William Borland
- Applicant: Daniel I. Amey , William Borland
- Applicant Address: US DE Wilmington
- Assignee: E.I. du Pont de Nemours and Company
- Current Assignee: E.I. du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Main IPC: H01L23/538
- IPC: H01L23/538
Abstract:
A device comprising a power core wherein said power core comprises: at least one embedded singulated capacitor wherein said embedded singulated capacitor comprises at least a first electrode and a second electrode and wherein said embedded singulated capacitor is positioned on the outer layer of the power core so that at least one Vcc (power) terminal and at least one Vss (ground) terminal of a semiconductor device can be directly connected to at least one first and at least one second electrode, respectively and wherein the first and second electrode of the singulated capacitor is interconnected to the first and second electrode respectively of an external planar capacitor embedded within a printed wiring motherboard.
Public/Granted literature
- US20080236877A1 Power core devices and methods of making thereof Public/Granted day:2008-10-02
Information query
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