Invention Grant
US07902664B2 Semiconductor package having passive component and semiconductor memory module including the same
有权
具有无源元件的半导体封装和包括该元件的半导体存储器模块
- Patent Title: Semiconductor package having passive component and semiconductor memory module including the same
- Patent Title (中): 具有无源元件的半导体封装和包括该元件的半导体存储器模块
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Application No.: US11878084Application Date: 2007-07-20
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Publication No.: US07902664B2Publication Date: 2011-03-08
- Inventor: Hyo-jae Bang , Dong-chun Lee , Seong-chan Han , Kyung-du Kim , Sun-kyu Hwang
- Applicant: Hyo-jae Bang , Dong-chun Lee , Seong-chan Han , Kyung-du Kim , Sun-kyu Hwang
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2006-0071574 20060728
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
Example embodiments relate to a semiconductor package. The semiconductor package may include a mounting substrate, a semiconductor chip mounted to the mounting substrate, at least one passive component passing therethrough and mounted to the mounting substrate, and a cover covering the mounting substrate, the semiconductor chip and the at least one passive component.
Public/Granted literature
- US20080023812A1 Semiconductor package having passive component and semiconductor memory module including the same Public/Granted day:2008-01-31
Information query
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