Invention Grant
US07902682B2 Ultraviolet energy curable tape and method of making a semiconductor chip using the tape
有权
紫外线固化胶带和使用胶带制造半导体芯片的方法
- Patent Title: Ultraviolet energy curable tape and method of making a semiconductor chip using the tape
- Patent Title (中): 紫外线固化胶带和使用胶带制造半导体芯片的方法
-
Application No.: US10715689Application Date: 2003-11-18
-
Publication No.: US07902682B2Publication Date: 2011-03-08
- Inventor: Timothy C. Krywanczyk , Donald W. Brouillette , Steven A. Martel , Matthew R. Whalen
- Applicant: Timothy C. Krywanczyk , Donald W. Brouillette , Steven A. Martel , Matthew R. Whalen
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Joseph Petrokaitis, Esq.
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
There is provided a UV energy curable tape comprising an adhesive material including a UV energy curable oligomer, a UV energy initiator, and a material which emits optical light when the tape composition is substantially fully cured. A semiconductor chip made using the tape is also provided.
Public/Granted literature
- US20050104147A1 Ultraviolet energy curable tape and method of making a semiconductor chip using the tape Public/Granted day:2005-05-19
Information query
IPC分类:
