Invention Grant
- Patent Title: Boundary acoustic wave device and method for manufacturing the same
- Patent Title (中): 边界声波装置及其制造方法
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Application No.: US12412446Application Date: 2009-03-27
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Publication No.: US07902717B2Publication Date: 2011-03-08
- Inventor: Shin Saijou , Toshiyuki Fuyutsume
- Applicant: Shin Saijou , Toshiyuki Fuyutsume
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2006-267805 20060929
- Main IPC: H01L41/083
- IPC: H01L41/083

Abstract:
A boundary acoustic wave device includes a piezoelectric substance, a dielectric substance laminated on the piezoelectric substance, and an electrode film disposed at a boundary between the piezoelectric substance and a dielectric substance, the device utilizing a boundary acoustic wave propagating along the boundary, wherein the electrode film is any one Au alloy electrode film of an Au alloy electrode film including Cu at a ratio of about 0.01% to about 4.8% by weight, an Au alloy electrode film including Pd at a ratio of about 0.01% to about 6.8% by weight, and an Au alloy electrode film including Ni at a ratio of about 0.01% to about 3.5% by weight.
Public/Granted literature
- US20090179521A1 BOUNDARY ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2009-07-16
Information query
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