Invention Grant
- Patent Title: Alignment method of two substrates by microcoils
- Patent Title (中): 通过微线圈对两个衬底的对准方法
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Application No.: US12320879Application Date: 2009-02-06
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Publication No.: US07902837B2Publication Date: 2011-03-08
- Inventor: Maxime Rousseau , Bernard Viala
- Applicant: Maxime Rousseau , Bernard Viala
- Applicant Address: FR Paris
- Assignee: Commissariat a l'Energie Atomique
- Current Assignee: Commissariat a l'Energie Atomique
- Current Assignee Address: FR Paris
- Agency: Oliff & Berridge, PLC
- Priority: FR0800957 20080222
- Main IPC: G01R27/26
- IPC: G01R27/26 ; G01R33/02 ; G01C9/00
Abstract:
Substrates to be aligned include microcoils arranged at the level of their facing surfaces. In an alignment phase, power is supplied to at least the microcoils of the first substrate, whereas the inductance of the microcoils of the second substrate is measured. The microcoils are preferably flat microcoils in the form of a spiral or a serpentine.
Public/Granted literature
- US20090215207A1 Alignment method of two substrates by microcoils Public/Granted day:2009-08-27
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