Invention Grant
- Patent Title: High-bandwidth interconnect network for an integrated circuit
- Patent Title (中): 用于集成电路的高带宽互连网络
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Application No.: US11901182Application Date: 2007-09-14
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Publication No.: US07902862B2Publication Date: 2011-03-08
- Inventor: Dana How , Godfrey P. D'Souza , Malcolm J. Wing , Colin N. Murphy , Arun Jangity
- Applicant: Dana How , Godfrey P. D'Souza , Malcolm J. Wing , Colin N. Murphy , Arun Jangity
- Applicant Address: US CA Cupertino
- Assignee: Agate Logic, Inc.
- Current Assignee: Agate Logic, Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Radlo & Su LLP
- Main IPC: H03K19/173
- IPC: H03K19/173
Abstract:
A bus structure providing pipelined busing of data between logic circuits and special-purpose circuits of an integrated circuit, the bus structure including a network of pipelined conductors, and connectors selectively joining the pipelined conductors between the special-purpose circuits, other pipelined connectors, and the logic circuits.
Public/Granted literature
- US20090073967A1 High-bandwidth interconnect network for an integrated circuit Public/Granted day:2009-03-19
Information query
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