Invention Grant
- Patent Title: Extensible three dimensional circuit
- Patent Title (中): 可扩展三维电路
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Application No.: US12771135Application Date: 2010-04-30
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Publication No.: US07902869B1Publication Date: 2011-03-08
- Inventor: Richard J. Carter
- Applicant: Richard J. Carter
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H01L25/00
- IPC: H01L25/00 ; H03K19/177

Abstract:
An extensible three dimensional circuit includes an access layer and crossbar arrays overlying the access layer. The crossbar arrays are formed from tiled mini-arrays of crossing lines and electrically accessed by the access layer. The crossing lines comprise at least one bundle of traveling lines, the at least one bundle of traveling lines moving through the circuit both laterally and vertically. Programmable crosspoint devices are disposed between the crossing lines.
Information query
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