Invention Grant
- Patent Title: Stacked resonator
- Patent Title (中): 堆叠谐振器
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Application No.: US11656540Application Date: 2007-01-23
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Publication No.: US07902944B2Publication Date: 2011-03-08
- Inventor: Tatsuya Fukunaga
- Applicant: Tatsuya Fukunaga
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2006-017252 20060126
- Main IPC: H01P1/205
- IPC: H01P1/205 ; H01P7/08

Abstract:
Provided are a stacked resonator capable of achieving miniaturization and minimum loss, and a stacked resonator capable of suppressing any unnecessary resonance mode due to interdigital-coupling. The stacked resonator includes a first conductor group having a plurality of conductor lines in a stacking arrangement, and a second conductor group having a plurality of other conductor lines in a stacking arrangement so as to be alternately provided opposing to the conductor lines in the first conductor group, thereby establishing an interdigital-coupling together with the first conductor group.
Public/Granted literature
- US20070171005A1 Stacked resonator Public/Granted day:2007-07-26
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