Invention Grant
- Patent Title: Thermal printhead
- Patent Title (中): 热敏打印头
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Application No.: US12305290Application Date: 2007-06-19
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Publication No.: US07903132B2Publication Date: 2011-03-08
- Inventor: Teruhisa Sako , Naofumi Kanei
- Applicant: Teruhisa Sako , Naofumi Kanei
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2006-171267 20060621; JP2006-172346 20060622
- International Application: PCT/JP2007/062263 WO 20070619
- International Announcement: WO2007/148663 WO 20071227
- Main IPC: B41J2/335
- IPC: B41J2/335

Abstract:
A thermal printhead (A1) includes an insulating substrate and a heating resistor element (3) formed on the substrate and elongated in the primary scanning direction. A plurality of electrodes are connected to the heating resistor element (3). The electrodes and the heating resistor element (3) are covered by a protective film (4). The protective film (4) includes a first layer (41), a second layer (42) and a third layer (43). The second layer (42) is porous and includes a plurality of pores (42a). The third layer (43) partially enters each of the pores (42a) so that the upper surface pf the protective film (4) is an irregular surface including a plurality or recesses (4a).
Public/Granted literature
- US20090174757A1 THERMAL PRINTHEAD Public/Granted day:2009-07-09
Information query
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