Invention Grant
- Patent Title: Method and apparatus for inspecting pattern defects
- Patent Title (中): 检查图案缺陷的方法和装置
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Application No.: US12366003Application Date: 2009-02-05
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Publication No.: US07903249B2Publication Date: 2011-03-08
- Inventor: Minoru Yoshida , Shunji Maeda , Atsushi Shimoda , Kaoru Sakai , Takafumi Okabe
- Applicant: Minoru Yoshida , Shunji Maeda , Atsushi Shimoda , Kaoru Sakai , Takafumi Okabe
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2001-277681 20010913
- Main IPC: G01N21/55
- IPC: G01N21/55

Abstract:
An apparatus and method for inspecting defects includes an illuminator for irradiating light having an ultraviolet wavelength emitted from a light source onto a specimen through a reflection objective lens, an image-former for forming an image of light reflected from the specimen by the illumination of the light from the illuminator, which is passed through at least the reflection objective lens, a detector which detects the image of light formed by the image-former with an image sensor, and an image processor for processing a signal output from the detector to detect defects on the specimen. The image sensor is a reverse-surface irradiation type image sensor.
Public/Granted literature
- US20090153840A1 Method And Apparatus For Inspecting Pattern Defects Public/Granted day:2009-06-18
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