An integrated lead suspension (ILS) has a constrained layer damper (CLD) that attenuates vibration of the ILS. The CLD is applied over an already assembled ILS such that the CLD is applied to the cover layer. The CLD encapsulates the underlying conductors and the cover layer. The damping layer is formed on the cover layer. The width of damping layer is substantially equal to the width of cover layer as it extends over the conductors. The constraining layer extends laterally beyond the width of the damping and cover layers and down to the dielectric layer, which resides on a base layer. The constraining layer has a lateral width equal to that of the dielectric layer.