Invention Grant
- Patent Title: Aluminum electrode plate for electrolytic capacitor
- Patent Title (中): 电解电容铝电极板
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Application No.: US12304788Application Date: 2007-08-24
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Publication No.: US07903391B2Publication Date: 2011-03-08
- Inventor: Masahiko Katano , Masashi Isobe , Yuya Yoshida
- Applicant: Masahiko Katano , Masashi Isobe , Yuya Yoshida
- Applicant Address: JP Tokyo
- Assignee: Nippon Light Metal Company, Ltd.
- Current Assignee: Nippon Light Metal Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: JP2006-254920 20060920
- International Application: PCT/JP2007/000901 WO 20070824
- International Announcement: WO2008/035454 WO 20080327
- Main IPC: H01G9/04
- IPC: H01G9/04

Abstract:
This invention provides an aluminum electrode plate for an electrolytic capacitor, which, even when the thickness of an etching layer is large, can realize a high level of impregnation of a solid electrolyte and can reduce ESR of a capacitor. An aluminum plate having an aluminum purity of not less than 99.98% by mass is etched to form an etching layer having a depth of 70 μm or above. When a plane cross section of a position deeper than 20 μm from the surface in the etching layer is measured with an image analyzer, for each measured face, not less than 70% of the total number of pits within the measured face is accounted for by pits having a diameter of 0.01 to 1 μm φ; in terms of equivalent circle diameter. The aluminum plate has an aluminum purity of not less than 99.98% by mass and comprises 5 to 50 ppm of Fe and 5 to 40 ppm of Cu with the balance consisting of inevitable impurities. The aluminum plate further contains 1×107 to 1010/cm3 iron-containing intermetallic compound having a particle diameter of 0.1 to 1.0 μm φ in terms of spheres.
Public/Granted literature
- US20090303661A1 ALUMINUM ELECTRODE PLATE FOR ELECTROLYTIC CAPACITOR Public/Granted day:2009-12-10
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