Invention Grant
- Patent Title: Heat dissipation device of electronic circuit modules
- Patent Title (中): 电子电路模块散热装置
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Application No.: US12591338Application Date: 2009-11-17
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Publication No.: US07903408B1Publication Date: 2011-03-08
- Inventor: Hong-Chi Yu
- Applicant: Hong-Chi Yu
- Applicant Address: TW Kaohsiung
- Assignee: Walton Advanced Engineering Inc.
- Current Assignee: Walton Advanced Engineering Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Bacon & Thomas, PLLC
- Priority: TW98135901A 20091023
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A heat dissipation device of electronic circuit modules has a substrate, a heat dissipation element and a housing. The housing is hollow and has an airflow passage therein. Heat generated when electronic components of the substrate is operated is conducted to the heat dissipation element and is guided out of the device by heat convection generated inside the housing by the design of the airflow passage.
Information query
