Invention Grant
US07904161B2 Lead adaptor having low resistance conductors and/or encapsulated housing 有权
导线适配器具有低电阻导体和/或封装外壳

  • Patent Title: Lead adaptor having low resistance conductors and/or encapsulated housing
  • Patent Title (中): 导线适配器具有低电阻导体和/或封装外壳
  • Application No.: US11179304
    Application Date: 2005-07-12
  • Publication No.: US07904161B2
    Publication Date: 2011-03-08
  • Inventor: Thomas P. Osypka
  • Applicant: Thomas P. Osypka
  • Applicant Address: US FL Palm Harbor
  • Assignee: Oscor Inc.
  • Current Assignee: Oscor Inc.
  • Current Assignee Address: US FL Palm Harbor
  • Agency: Edwards Angell Palmer & Dodge LLP
  • Agent Scott D. Wofsy
  • Main IPC: A61N1/00
  • IPC: A61N1/00
Lead adaptor having low resistance conductors and/or encapsulated housing
Abstract:
An implantable lead adaptor is disclosed that includes an encapsulated thermoplastic housing defining a proximal end portion and a distal end portion. The proximal end portion has a first receptacle configured to receive a first type of connector assembly associated with a first implantable cardiac lead, and a second receptacle configured to receive a second type of connector assembly associated with a second implantable cardiac lead. An elongated flexible lead portion extends from the distal end portion of the adaptor housing. A connector assembly is operatively associated with a distal end section of the flexible lead portion of the adaptor for connection to an implantable pulse-generating device, such as, for example, an implantable pacemaker or defibrillator. Low resistance conductor wires electrically connect the connector assembly associated with the distal end section of the lead portion with the first and second receptacles of the adaptor housing.
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