Invention Grant
- Patent Title: Medical electrical lead body designs incorporating energy dissipating shunt
- Patent Title (中): 医疗电源引线体设计结合消能分流器
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Application No.: US11669661Application Date: 2007-01-31
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Publication No.: US07904178B2Publication Date: 2011-03-08
- Inventor: Terrell M. Williams , Michael Jay Ebert , Jordon D. Honeck , Richard Dean Ries , John L. Sommer , Pedro A. Meregotte
- Applicant: Terrell M. Williams , Michael Jay Ebert , Jordon D. Honeck , Richard Dean Ries , John L. Sommer , Pedro A. Meregotte
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agent Michael J. Ostrom; Stephen W. Bauer
- Main IPC: A61N1/00
- IPC: A61N1/00
Abstract:
An elongate body of a medical electrical lead includes at least one conductor formed into a coil that includes a first portion and a second portion, wherein the first portion extends within an outer insulation sheath and the second portion extends outside the outer insulation sheath to be exposed to an environment external to the lead body as an energy dissipating shunt.
Public/Granted literature
- US20070185556A1 MEDICAL ELECTRICAL LEAD BODY DESIGNS INCORPORATING ENERGY DISSIPATING SHUNT Public/Granted day:2007-08-09
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