Invention Grant
- Patent Title: Inventory tracking mechanism for virtual wafer circuit probing subcontract
- Patent Title (中): 虚拟晶圆电路探测分包的库存跟踪机制
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Application No.: US10853913Application Date: 2004-05-26
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Publication No.: US07904351B2Publication Date: 2011-03-08
- Inventor: Chia Ho Yang , Ming Ta Hsu , Shau Tsung Yu , Su Mei Chang , Tien Hui Chang
- Applicant: Chia Ho Yang , Ming Ta Hsu , Shau Tsung Yu , Su Mei Chang , Tien Hui Chang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: G06Q10/00
- IPC: G06Q10/00

Abstract:
The present disclosure provides an inventory tracking method for use with semiconductor product. The method can be used to track wafer lots transferred from a front end such as a fabrication (fab) facility, to a back end such as a wafer circuit probe facility. The method includes tracking a lot of wafers being sent to the back end facility and receiving a status report from the back end facility. The status report is compared to a predetermined criteria, and the lot is designated as a first type, such as slow moving, if the status report fails to meet the predetermined criteria. A payment plan is then associated with the lot due to it being designated as slow moving.
Public/Granted literature
- US20060010039A1 Inventory tracking mechanism for virtual wafer circuit probing subcontract Public/Granted day:2006-01-12
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