Invention Grant
- Patent Title: Probing system for integrated circuit devices
- Patent Title (中): 集成电路设备探测系统
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Application No.: US12114768Application Date: 2008-05-03
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Publication No.: US07904768B2Publication Date: 2011-03-08
- Inventor: Cheng-Wen Wu , Chih-Tsun Huang , Yu-Tsao Hsing
- Applicant: Cheng-Wen Wu , Chih-Tsun Huang , Yu-Tsao Hsing
- Applicant Address: TW Hsinchu
- Assignee: National Tsing Hua University
- Current Assignee: National Tsing Hua University
- Current Assignee Address: TW Hsinchu
- Agency: Egbert Law Offices PLLC
- Main IPC: G01R31/28
- IPC: G01R31/28

Abstract:
A probing system for an integrated circuit device, which transmits a testing data/signal between an automatic test equipment (ATE) and an integrated circuit device, is disclosed. The probing system includes a test head having a first transceiving module. There is a test station having a test unit coupled to the test head to perform a test operation. A communication module has a second transceiving module configured to exchange data with the first transceiving module in a wireless manner. There is an integrated circuit device having a core circuit being tested, and a test module having a self-test circuit coupled to the core circuit and the communication module for performing the core circuit self-testing.
Public/Granted literature
- US20080209293A1 PROBING SYSTEM FOR INTEGRATED CIRCUIT DEVICES Public/Granted day:2008-08-28
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