Invention Grant
- Patent Title: Method of area compaction for integrated circuit layout design
- Patent Title (中): 集成电路布局设计的面积压实方法
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Application No.: US11958605Application Date: 2007-12-18
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Publication No.: US07904869B2Publication Date: 2011-03-08
- Inventor: Kathleen C. Yu , Scott D. Hector , Robert L. Maziasz , Claudia A. Stanley , James E. Vasck
- Applicant: Kathleen C. Yu , Scott D. Hector , Robert L. Maziasz , Claudia A. Stanley , James E. Vasck
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agent Kim-Marie Vo; Michael J. Balconi-Lamica
- Main IPC: G06F9/455
- IPC: G06F9/455

Abstract:
A method of area compaction for integrated circuit layout design comprises determining physical extent boundaries for each layer of at least first circuit and second circuit building blocks. Determining physical extent boundaries includes determining for each respective layer of the first circuit and second circuit building blocks (i) a used portion and (ii) a free portion. The used portion corresponds to a functional portion of the respective circuit building block and the free portion corresponds to a non-functional portion of the respective circuit building block. The method further includes establishing packing keys with respect to the determined physical extent boundaries of each layer of the first circuit and second circuit building blocks, respectively. The packing keys define an interlocking characteristic for packing compaction of the corresponding first circuit or second circuit building block with another circuit building block.
Public/Granted literature
- US20090158229A1 METHOD OF AREA COMPACTION FOR INTEGRATED CIRCUIT LAYOUT DESIGN Public/Granted day:2009-06-18
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