Invention Grant
- Patent Title: Method and apparatus for leak-proof mounting of a liquid cooling device on an integrated circuit
- Patent Title (中): 液体冷却装置在集成电路上的防漏安装方法和装置
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Application No.: US11703867Application Date: 2007-02-07
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Publication No.: US07905276B2Publication Date: 2011-03-15
- Inventor: William J. Clough , Franz M. Schuotte
- Applicant: William J. Clough , Franz M. Schuotte
- Applicant Address: US OR Portland
- Assignee: Onscreen Technology, Inc.
- Current Assignee: Onscreen Technology, Inc.
- Current Assignee Address: US OR Portland
- Agent William W. Haefliger
- Main IPC: F28F7/00
- IPC: F28F7/00
Abstract:
Apparatus for cooling of an electrical circuit element on an electrical element package, comprising in combination, structure including a hollow body defining a cavity for containing cooling fluid located in heat transfer relation with said element, a rotatably tightenable connection between said package and said hollow body, and acting to block leakage of cooling fluid from said cavity.
Public/Granted literature
- US20070181555A1 Method and apparatus for leak-proof mounting of a liquid cooling device on an integrated circuit Public/Granted day:2007-08-09
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