Invention Grant
- Patent Title: Connector and substrate mounting method for the same
- Patent Title (中): 连接器和基板安装方法相同
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Application No.: US12181550Application Date: 2008-07-29
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Publication No.: US07905752B2Publication Date: 2011-03-15
- Inventor: Taishi Morikawa
- Applicant: Taishi Morikawa
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JPP2007-201973 20070802
- Main IPC: H01R13/66
- IPC: H01R13/66

Abstract:
A connector includes a connector housing made of an insulator, a first terminal having one end fixed to the connector housing and the other end connected to an opposite side connector, and a second terminal having one end electrically connected to a circuit on a substrate and the other end fixed to the connector housing. The connector housing includes an opening which is open in a direction orthogonal to a surface of the substrate in a state of being mounted on the substrate and through which one end of the first terminal and the other end of the second terminal enter. The opening permits an electronic component being connected to one end of the first terminal and the other end of the second terminal to enter thereinto.
Public/Granted literature
- US20090035994A1 CONNECTOR AND SUBSTRATE MOUNTING METHOD FOR THE SAME Public/Granted day:2009-02-05
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