Invention Grant
- Patent Title: Method for holding substrate in vacuum
- Patent Title (中): 将基板保持在真空中的方法
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Application No.: US11924054Application Date: 2007-10-25
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Publication No.: US07905979B2Publication Date: 2011-03-15
- Inventor: Naoto Yokoyama , Mitsuaki Morimoto , Makoto Nakahara , Takao Murayama , Akira Hirai , Satoshi Yawata
- Applicant: Naoto Yokoyama , Mitsuaki Morimoto , Makoto Nakahara , Takao Murayama , Akira Hirai , Satoshi Yawata
- Applicant Address: JP Tokyo
- Assignee: Hitachi Plant Technologies, Ltd.
- Current Assignee: Hitachi Plant Technologies, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Edwards Angell Palmer & Dodge LLP
- Agent David G. Conlin; Steven M. Jensen
- Priority: JP2002-059462 20020305; JP2002-318911 20021031
- Main IPC: B29C65/00
- IPC: B29C65/00
Abstract:
In a method of the present invention for holding a substrate in a vacuum, a glass substrate (5) is held by an adhesive pad (20) or an adhesive sheet, both of which are made from a material containing a diene based resin, whereby an adhesive agent is prevented from remaining on the substrate, and the adhesive sheet can be detached with ease from the substrate after assembling the substrates.
Public/Granted literature
- US20080099137A1 METHOD FOR HOLDING SUBSTRATE IN VACUUM Public/Granted day:2008-05-01
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