Invention Grant
- Patent Title: Adherence of temperature-sensitive inclusions on edible lightweight cores
- Patent Title (中): 温度敏感夹杂物对可食用轻质芯的粘附
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Application No.: US10532123Application Date: 2003-10-21
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Publication No.: US07906162B2Publication Date: 2011-03-15
- Inventor: Keith Woelfel
- Applicant: Keith Woelfel
- Applicant Address: US VA McLean
- Assignee: Mars Incorporated
- Current Assignee: Mars Incorporated
- Current Assignee Address: US VA McLean
- Agency: Fitzpatrick, Cella, Harper & Scinto
- International Application: PCT/US03/33497 WO 20031021
- International Announcement: WO2004/037013 WO 20040506
- Main IPC: A23P1/08
- IPC: A23P1/08
Abstract:
Temperature-sensitive inclusions are adhered to edible lightweight cores using an ambient temperature process.
Public/Granted literature
- US20060204625A1 Adherence of temperature-sensitive inclusions on edible lightweight cores Public/Granted day:2006-09-14
Information query
