Invention Grant
- Patent Title: Fabrication method of circuit board
- Patent Title (中): 电路板制作方法
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Application No.: US12432367Application Date: 2009-04-29
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Publication No.: US07906377B2Publication Date: 2011-03-15
- Inventor: Wen-Yuan Chang , Wei-Cheng Chen , Yeh-Chi Hsu
- Applicant: Wen-Yuan Chang , Wei-Cheng Chen , Yeh-Chi Hsu
- Applicant Address: TW Taipei Hsien
- Assignee: VIA Technologies, Inc.
- Current Assignee: VIA Technologies, Inc.
- Current Assignee Address: TW Taipei Hsien
- Agency: J.C. Patents
- Priority: TW98111229A 20090403
- Main IPC: H01L21/50
- IPC: H01L21/50

Abstract:
A fabrication method of a circuit board is provided. A substrate, a top pad, a base pad electrically connecting the top pad, and a top and a base solder resist layers are provided. The top and the base pads are disposed on two opposite surfaces of the substrate, respectively. The top solder resist layer having a first opening partially exposing the top pad and the base solder resist layer having a second opening partially exposing the base pad are disposed on the two surfaces, respectively. A conductive layer covering the base solder resist layer and the base pad is formed. A plating resist layer having a third opening is formed on the conductive layer. A current is applied to the conductive layer through the third opening for electroplating a pre-bump on the top pad. The plating resist layer and the conductive layer are then removed.
Public/Granted literature
- US20100155939A1 CIRCUIT BOARD AND FABRICATION METHOD THEREOF AND CHIP PACKAGE STRUCTURE Public/Granted day:2010-06-24
Information query
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