Invention Grant
- Patent Title: Method for applying solder to redistribution lines
- Patent Title (中): 将焊料应用于再分配线的方法
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Application No.: US11766326Application Date: 2007-06-21
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Publication No.: US07906421B2Publication Date: 2011-03-15
- Inventor: Octavio Trovarelli , Martin Reiss , Bernd Zimmermann
- Applicant: Octavio Trovarelli , Martin Reiss , Bernd Zimmermann
- Applicant Address: DE München
- Assignee: Qimonda AG
- Current Assignee: Qimonda AG
- Current Assignee Address: DE München
- Agency: Cohen Pontani Lieberman & Pavane LLP
- Priority: DE102006028811 20060621
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/44 ; H01L21/4763
Abstract:
In a method of making an electronic component, an electrically conductive redistribution line is formed on a surface of a semiconductor chip. The redistribution line includes a solder pad. A covering material is formed over the solder pad and an uncovered portion of the redistribution line is passivated. The covering material prevents passivation of the solder pad. Solder is then formed over the solder pad such that the uncovered portion of the redistribution line has solder resist properties due to the passivating.
Public/Granted literature
- US20070298602A1 Method for Applying Solder to Redistribution Lines Public/Granted day:2007-12-27
Information query
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