Invention Grant
- Patent Title: Metal surfaces to inhibit ethylenically unsaturated monomer polymerization
- Patent Title (中): 金属表面抑制烯属不饱和单体聚合
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Application No.: US10571797Application Date: 2003-09-24
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Publication No.: US07906679B2Publication Date: 2011-03-15
- Inventor: Salvador Aldrett-Lee , Diane E. Allen , Olan Stanley Fruchey , Roger L. Roundy , Tao Wang
- Applicant: Salvador Aldrett-Lee , Diane E. Allen , Olan Stanley Fruchey , Roger L. Roundy , Tao Wang
- Applicant Address: US PA Philadelphia
- Assignee: Arkema Inc.
- Current Assignee: Arkema Inc.
- Current Assignee Address: US PA Philadelphia
- Agent Steven D. Boyd
- International Application: PCT/US03/30076 WO 20030924
- International Announcement: WO2005/040084 WO 20050506
- Main IPC: C07C51/16
- IPC: C07C51/16 ; B01J19/00

Abstract:
Materials for making apparatus and a method of inhibiting polymerization during manufacture, purification, handling and storage of subject ethylenically unsaturated monomers are disclosed. In particular, copper or metals containing copper, in the presence of oxygen, have inhibit undesired polymerization resulting in polymer fouling in apparatus used during the manufacture, purification, handling and storage of the monomers, such as acrylic acid, methacrylic acid, acrylic acid esters and methacrylic acid esters. The copper or copper alloys as described herein, in the presence of an oxygen-containing gas, exhibit self-inhibiting surface characteristics when used to make at least a portion of the apparatus to inhibit polymerization of the monomers in contact with the portion of the apparatus including such copper-containing metal.
Public/Granted literature
- US20080228002A1 Metal Surfaces to Inhibit Ethylenically Unsaturated Monomer Polymerization Public/Granted day:2008-09-18
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