In one implementation, a PCB having an array of vias and electrical terminals disposed on the side of the PCB opposite the side configured to receive a grid array package are disclosed herein. The array of vias have pads and forms a pattern of repetitive rows and columns. A substantially consistent intervia distance is defined along an intervia axis between each adjacent via in each of the rows and columns. A pair of electrical terminals are positioned adjacent one another along an electrical terminal axis between at least two of the vias and the electrical terminal axis intersects the intervia axis. In another implementation, a group of four adjacent vias form a substantially rectangular shape having one of four vias positioned at each of four corners of the rectangular shape. One electrical terminal is positioned within the four vias without contacting any of the four vias.