Invention Grant
- Patent Title: Bipolar device and fabrication method thereof
- Patent Title (中): 双极器件及其制造方法
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Application No.: US12176635Application Date: 2008-07-21
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Publication No.: US07906796B2Publication Date: 2011-03-15
- Inventor: Kazuhiro Mochizuki , Hidekatsu Onose , Natsuki Yokoyama
- Applicant: Kazuhiro Mochizuki , Hidekatsu Onose , Natsuki Yokoyama
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Miles & Stockbridge P.C.
- Priority: JP2007-222455 20070829
- Main IPC: H01L29/74
- IPC: H01L29/74

Abstract:
In a bipolar device, such as transistor or a thyristor, the emitter layer or the anode layer is formed of two high-doped and low-doped layers, a semiconductor region for suppressing recombination comprising an identical semiconductor having an impurity density identical with that of the low-doped layer is present being in contact with a base layer or a gate layer and a surface passivation layer, and the width of the semiconductor region for suppressing recombination is defined equal with or longer than the diffusion length of the carrier. This provides, among other things, an effect of attaining reduction in the size of the bipolar transistor or improvement of the switching frequency of the thyristor without deteriorating the performance.
Public/Granted literature
- US20090057685A1 BIPOLAR DEVICE AND FABRICATION METHOD THEREOF Public/Granted day:2009-03-05
Information query
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