Invention Grant
US07906798B2 Semiconductor device having buffer layer between sidewall insulating film and semiconductor substrate
有权
在侧壁绝缘膜和半导体衬底之间具有缓冲层的半导体器件
- Patent Title: Semiconductor device having buffer layer between sidewall insulating film and semiconductor substrate
- Patent Title (中): 在侧壁绝缘膜和半导体衬底之间具有缓冲层的半导体器件
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Application No.: US11950102Application Date: 2007-12-04
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Publication No.: US07906798B2Publication Date: 2011-03-15
- Inventor: Hiroyuki Ohta , Katsuaki Ookoshi
- Applicant: Hiroyuki Ohta , Katsuaki Ookoshi
- Applicant Address: JP Yokohama
- Assignee: Fujitsu Semiconductor Limited
- Current Assignee: Fujitsu Semiconductor Limited
- Current Assignee Address: JP Yokohama
- Agency: Fujitsu Patent Center
- Priority: JP2006-336269 20061213
- Main IPC: H01L27/092
- IPC: H01L27/092

Abstract:
A semiconductor device includes an NMOS transistor and a PMOS transistor. The NMOS transistor includes a channel area formed in a silicon substrate, a gate electrode formed on a gate insulating film in correspondence with the channel area, and a source area and a drain area formed in the silicon substrate having the channel area situated therebetween. The PMOS transistor includes another channel area formed in the silicon substrate, another gate electrode formed on another gate insulating film in correspondence with the other channel area, and another source area and another drain area formed in the silicon substrate having the other channel area situated therebetween. The gate electrode has first sidewall insulating films. The other gate electrode has second sidewall insulating films. The distance between the second sidewall insulating films and the silicon substrate is greater than the distance between the first sidewall insulating films and the silicon substrate.
Public/Granted literature
- US20080142838A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2008-06-19
Information query
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