Invention Grant
- Patent Title: Packaged device and method of manufacturing the same
- Patent Title (中): 封装装置及其制造方法
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Application No.: US12164670Application Date: 2008-06-30
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Publication No.: US07906822B2Publication Date: 2011-03-15
- Inventor: Yoshihiro Mizuno , Norinao Kouma , Hisao Okuda , Hiromitsu Soneda , Tsuyoshi Matsumoto , Osamu Tsuboi
- Applicant: Yoshihiro Mizuno , Norinao Kouma , Hisao Okuda , Hiromitsu Soneda , Tsuyoshi Matsumoto , Osamu Tsuboi
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2007-173077 20070629
- Main IPC: H01L29/84
- IPC: H01L29/84
Abstract:
A packaged device includes a package having an inner surface defining a closed internal space, a device chip fixed to the package in the internal space, and a parylene film covering at least a part of the inner surface of the package and/or at least a part of a surface of the device chip.
Public/Granted literature
- US20090001487A1 PACKAGED DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2009-01-01
Information query
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