Invention Grant
- Patent Title: MEMS apparatus and method of manufacturing the same
- Patent Title (中): MEMS装置及其制造方法
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Application No.: US12195587Application Date: 2008-08-21
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Publication No.: US07906823B2Publication Date: 2011-03-15
- Inventor: Kazuhiro Suzuki , Michihiko Nishigaki , Yutaka Onozuka , Hiroshi Yamada , Kazuhiko Itaya , Hideyuki Funaki
- Applicant: Kazuhiro Suzuki , Michihiko Nishigaki , Yutaka Onozuka , Hiroshi Yamada , Kazuhiko Itaya , Hideyuki Funaki
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Turocy & Watson, LLP
- Priority: JP2007-215141 20070821
- Main IPC: H01L29/84
- IPC: H01L29/84
Abstract:
A MEMS apparatus includes a MEMS unit formed on a semiconductor substrate and a cover provided with a pore and serving to seal the MEMS unit. The pore is sealed with a sealing material shaped in a sphere or a hemisphere.
Public/Granted literature
- US20090050988A1 MEMS APPARATUS AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2009-02-26
Information query
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