Invention Grant
US07906831B2 Semiconductor device with capacitor arrangement electrically coupled to inductor coil
有权
具有电耦合到电感线圈的电容器布置的半导体器件
- Patent Title: Semiconductor device with capacitor arrangement electrically coupled to inductor coil
- Patent Title (中): 具有电耦合到电感线圈的电容器布置的半导体器件
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Application No.: US12235614Application Date: 2008-09-23
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Publication No.: US07906831B2Publication Date: 2011-03-15
- Inventor: Peter Baumgartner , Philipp Riess
- Applicant: Peter Baumgartner , Philipp Riess
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Infineon Technologies
- Agent Philip H. Schlazer
- Main IPC: H01L29/94
- IPC: H01L29/94

Abstract:
One or more embodiments relate to a semiconductor device, comprising: a inductor coil including a winding; and a capacitor arrangement including at least one capacitor, the capacitor arrangement electrically coupled to the inductor coil, the footprint of the capacitor arrangement at least partially overlapping the footprint of the inductor coil.
Public/Granted literature
- US20100072572A1 SEMICONDUCTOR DEVICE Public/Granted day:2010-03-25
Information query
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