A die module and method for assembling such a die module is provided. For example, present embodiments include providing a substrate and coupling a first sub-stack to the substrate, wherein the first sub-stack includes two or more die arranged in a first shingle stack configuration relative to one another such that an upper portion of each die in the first sub-stack is accessible, the first shingle stack configuration having a first skew. Further, present embodiments include stacking a second sub-stack on top of the first sub-stack, wherein the second sub-stack includes two or more die arranged in a second shingle stack configuration relative to one another such that an upper portion of each die in the second sub-stack is accessible, the second shingle stack configuration having a second skew that is different than the first skew.