Invention Grant
- Patent Title: Substrate measuring stage
- Patent Title (中): 基板测量台
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Application No.: US12210759Application Date: 2008-09-15
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Publication No.: US07907289B2Publication Date: 2011-03-15
- Inventor: Masao Mizuta , Motoaki Hamada
- Applicant: Masao Mizuta , Motoaki Hamada
- Applicant Address: JP
- Assignee: Horiba, Ltd.
- Current Assignee: Horiba, Ltd.
- Current Assignee Address: JP
- Agency: Cantor Colburn LLP
- Priority: JP2007-238167 20070913; JP2008-157270 20080616
- Main IPC: G01B11/14
- IPC: G01B11/14 ; G01B1/06

Abstract:
A substrate measuring stage used for a curve measuring system measuring a curve of the substrate and an ordinary measuring system measuring each of or one of a physical quantity and a chemical quantity of the substrate other than the curve, may include the mounting board movable between an ordinary measurement position for the ordinary measuring system and a retreat position away from and downward of the ordinary measurement position; the plurality of support pins insertable into through-holes provided in the mounting board and fixed to a curve measurement position for the curve measuring system; and a drive mechanism vertically moving the mounting board between the ordinary measurement position and the retreat position. The curve measurement position is set between the ordinary measurement position and the retreat position.
Public/Granted literature
- US20090073460A1 SUBSTRATE MEASURING STAGE Public/Granted day:2009-03-19
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