Invention Grant
- Patent Title: Metallised security element
- Patent Title (中): 金属安全元件
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Application No.: US11661487Application Date: 2005-08-29
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Publication No.: US07907339B2Publication Date: 2011-03-15
- Inventor: Wayne Robert Tompkin , Andreas Schilling
- Applicant: Wayne Robert Tompkin , Andreas Schilling
- Applicant Address: CH Zug
- Assignee: OVD Kinegram AG
- Current Assignee: OVD Kinegram AG
- Current Assignee Address: CH Zug
- Agency: Hoffmann & Baron, LLP
- Priority: DE102004042136 20040830
- International Application: PCT/EP2005/009287 WO 20050829
- International Announcement: WO2006/024478 WO 20060309
- Main IPC: G02B5/18
- IPC: G02B5/18

Abstract:
The invention concerns a security element (11) in the form of a multi-layer film body, a security document having such a security element and a process for the production of such a security element. The film body on a carrier film (10) has a release layer (20), a protective lacquer layer (21), a replication lacquer layer (22) with relief structures (25, 26), a metal layer (23) and an adhesive layer (24). A first relief structure (25) has a depth-to-width ratio of >0.5, whereby the metal layer (23) is more transparent in the region of the first relief structure (25). A second relief structure (26) has a low depth-to-width ratio whereby the metal layer (23) is less transparent or is opaque in the region of the second relief structure (26).
Public/Granted literature
- US20080094713A1 Metallised Security Element Public/Granted day:2008-04-24
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