Invention Grant
US07907367B1 Punched gimbal dimple with a coined periphery in a head suspension
有权
打孔的万向节凹坑与头部悬挂中的外围造型
- Patent Title: Punched gimbal dimple with a coined periphery in a head suspension
- Patent Title (中): 打孔的万向节凹坑与头部悬挂中的外围造型
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Application No.: US11942563Application Date: 2007-11-19
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Publication No.: US07907367B1Publication Date: 2011-03-15
- Inventor: David Chocholaty , Leroy Wielenga , Chu Wong
- Applicant: David Chocholaty , Leroy Wielenga , Chu Wong
- Applicant Address: US CA Murrieta
- Assignee: Magnecomp Corporation
- Current Assignee: Magnecomp Corporation
- Current Assignee Address: US CA Murrieta
- Agency: Intellectual Property Law Offices of Joel Voelzke, APC
- Main IPC: G11B5/55
- IPC: G11B5/55

Abstract:
A punched gimbal dimple with an annular coined periphery extending outward from the dimple in a head suspension and a method for producing such a dimple. The dimple and its coined periphery are fabricated from a dimple punch and a die with a raised coining surface. The coined area on the dimple periphery can be seen by optical systems as a shiny ring, which is useful for aligning a slider to the dimple. The coined periphery is also less distorted by dimple punching than a non-coined periphery.
Information query
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