Invention Grant
- Patent Title: Heat removal system for computer rooms
- Patent Title (中): 电脑室散热系统
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Application No.: US12404784Application Date: 2009-03-16
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Publication No.: US07907395B2Publication Date: 2011-03-15
- Inventor: Richard M. Weber , William G. Wyatt
- Applicant: Richard M. Weber , William G. Wyatt
- Applicant Address: US MA Waltham
- Assignee: Raytheon Company
- Current Assignee: Raytheon Company
- Current Assignee Address: US MA Waltham
- Agency: Baker Botts L.L.P.
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K7/20 ; H05K5/00

Abstract:
According to one embodiment, a heat removal system for a computer room includes a heat pipe having two ends. One of the ends is thermally coupled to one or more of a number of components forming a portion of a computing system. The other end is thermally coupled to a heat dissipation mechanism. The heat pipe is operable to move heat from the components of the computing system to the heat dissipation mechanism.
Public/Granted literature
- US20090244829A1 Heat Removal System for Computer Rooms Public/Granted day:2009-10-01
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