Invention Grant
- Patent Title: Liquid cooling system
- Patent Title (中): 液体冷却系统
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Application No.: US12243990Application Date: 2008-10-02
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Publication No.: US07907398B2Publication Date: 2011-03-15
- Inventor: Robert D. Hrehor, Jr. , Travis North , Kevin M. Bailey
- Applicant: Robert D. Hrehor, Jr. , Travis North , Kevin M. Bailey
- Applicant Address: US TX Round Rock
- Assignee: Dell Products L.P.
- Current Assignee: Dell Products L.P.
- Current Assignee Address: US TX Round Rock
- Agency: Haynes and Boone, LLP
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K7/20
Abstract:
A liquid cooling system includes a board and a plurality of heat producing components (HPCs) coupled to the board. A mounting structure is located on the board adjacent to the plurality of HPCs. A liquid cooling device is coupled to the mounting structure such that the liquid cooling device engages each of the plurality of HPCs. The liquid cooling device may be decoupled from the mounting structure without detaching liquid conduits that supply it liquid in order to allow for the addition or removal of HPCs.
Public/Granted literature
- US20100085712A1 Liquid Cooling System Public/Granted day:2010-04-08
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