Invention Grant
US07907402B2 Cooling system 有权
冷却系统

  • Patent Title: Cooling system
  • Patent Title (中): 冷却系统
  • Application No.: US12266883
    Application Date: 2008-11-07
  • Publication No.: US07907402B2
    Publication Date: 2011-03-15
  • Inventor: Jack E Caveney
  • Applicant: Jack E Caveney
  • Applicant Address: US IL Tinley Park
  • Assignee: Panduit Corp.
  • Current Assignee: Panduit Corp.
  • Current Assignee Address: US IL Tinley Park
  • Agent Robert A. McCann; Christopher S. Clancy
  • Main IPC: H05K7/20
  • IPC: H05K7/20 G06F1/20
Cooling system
Abstract:
An electronic equipment cabinet configured to support electronic equipment is provided and may include a shelf positioned in the cabinet separating the cabinet into a first zone and a second zone. The first and second zones may be in fluid communication with a cool air source. In some examples, the first zone may receive cool air directly from a cool air source and the second zone may receive cool air from a duct in fluid communication with the cool air source. In another example, both the first and second zones may receive cool air from the cool air source through a duct. In yet other examples, the cabinet may include a baffle between the cool air source and one of the first zones and the second zones to selectively control a quantity of cool air provided to the one of the first and second zones.
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