Invention Grant
- Patent Title: Heat dissipating device
- Patent Title (中): 散热装置
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Application No.: US12081271Application Date: 2008-04-14
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Publication No.: US07907407B2Publication Date: 2011-03-15
- Inventor: Tsung-Te Ho
- Applicant: Tsung-Te Ho
- Applicant Address: TW TaoYuan
- Assignee: Chidae Electronics Co., Ltd.
- Current Assignee: Chidae Electronics Co., Ltd.
- Current Assignee Address: TW TaoYuan
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A heat dissipating device is designed with calm, efficient, and space economy performance includes a housing (1) having an exhaust (10), and an intake (32). A fan (4) disposed inside the housing (1) is relative to the intake (32). A set of fins (10) disposed inside the housing (1) is relative to the exhaust (10). Said fan (4) is rotated to circulate cooling air into the set of fins (6), and expel hot air absorbed by the fins out of the exhaust. A first heat pipe (5) is disposed on an inner wall of the housing (1) relative to the fan (4). The first heat pipe (5) has a condensing portion at one end encircles most of the fan; an evaporating portion at the other end extends to the inner wall of the housing, where a heat-generating electronic component is located, is thermally connected to the set of fins (6).
Public/Granted literature
- US20090257193A1 Heat dissipating device Public/Granted day:2009-10-15
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