Invention Grant
- Patent Title: Printed circuit board (PCB)with enhanced structural integrity
- Patent Title (中): 印刷电路板(PCB),具有更好的结构完整性
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Application No.: US12015541Application Date: 2008-01-17
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Publication No.: US07907417B2Publication Date: 2011-03-15
- Inventor: Gregory M. Jandzio , Anders P. Pedersen , Gary A. Rief , Walter M. Whybrew
- Applicant: Gregory M. Jandzio , Anders P. Pedersen , Gary A. Rief , Walter M. Whybrew
- Applicant Address: US FL Melbourne
- Assignee: Harris Corporation
- Current Assignee: Harris Corporation
- Current Assignee Address: US FL Melbourne
- Agency: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
- Main IPC: H05K7/02
- IPC: H05K7/02 ; H05K7/06 ; H05K7/08 ; H05K7/10

Abstract:
A printed circuit board (PCB) is disclose such that the PCB has enhanced structural integrity. The PCB has opposing, outer faces and interlayer interconnects that route RF, power and control signals. Connection areas are formed in or on at least on one face for connecting the interlayer interconnects and any electrical components. A metallic face sheet is secured onto at least one outer face, adding structural rigidity to the multilayer printed wiring board. A metallic face sheet can have apertures positioned to allow access to connection areas. RF components can be carried by a face sheet and operatively connected to connection areas. Antenna elements can be positioned on the same or an opposing face sheet and operatively connected to RF components to form a phased array printed wiring board (PWB) panel.
Public/Granted literature
- US20080245552A1 PRINTED WIRING BOARD WITH ENHANCED STRUCTURAL INTEGRITY Public/Granted day:2008-10-09
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